Vibration suppression technology for precision mechatronic systems in semiconductor manufacturing
面向半导体制造的精密机电系统振动抑制技术

摘要

半导体制造过程中的精密机电系统因其对高精度与稳定性的要求，振动问题成为影响加工质量和生产效率的关键因素。振动抑制技术通过控制和减小系统的振动，优化了加工过程中的精度和稳定性。本研究探讨了半导体制造中精密机电系统的振动抑制方法，分析了不同振动源的影响及其对系统性能的影响。结合现代振动控制技术，如主动控制、被动隔振以及复合抑制技术，本文提出了适合于半导体制造领域的振动抑制方案。通过实验验证，所提方法有效提升了设备的工作精度与生产稳定性，具有广泛的应用前景。

Abstract

Due to the high requirements for precision and stability in precision mechatronic systems during semiconductor manufacturing processes, vibration issues have become a key factor affecting processing quality and production efficiency. Vibration suppression technology optimizes precision and stability in the machining process by controlling and reducing system vibrations. This study explores vibration suppression methods for precision mechatronic systems in semiconductor manufacturing, analyzing the impact of different vibration sources and their effects on system performance. Integrating modern vibration control technologies such as active control, passive vibration isolation, and composite suppression techniques, this paper proposes a vibration suppression scheme suitable for the semiconductor manufacturing field. Experimental verification shows that the proposed method effectively improves the working precision and production stability of equipment, with broad application prospects.