Research on signal integrity analysis and impedance matching of 12-layer HDI circuit board for edge computing
面向边缘计算的12层HDI电路板信号完整性分析与阻抗匹配研究

摘要

随着电子设备小型化和功能集成化的发展，边缘计算成为了现代计算体系的重要组成部分。HDI（High-Density Interconnector）电路板在满足边缘计算系统对高性能、高密度电路需求方面发挥着至关重要的作用。本文围绕面向边缘计算的12层HDI电路板的信号完整性问题，重点探讨了信号传输过程中的噪声干扰、衰减以及阻抗匹配的优化方法。通过建立电路板模型并进行仿真分析，提出了一系列解决信号完整性问题的策略，包括选择合适的材料、优化布局设计和调整阻抗控制方法。合理的设计与优化可有效提升信号传输质量，为高性能边缘计算设备的开发提供了重要参考。

Abstract

With the development of miniaturization and functional integration of electronic devices, edge computing has become an important part of the modern computing system. HDI (High-Density Interconnector) circuit boards play a crucial role in meeting the requirements of edge computing systems for high-performance and high-density circuits. Focusing on the signal integrity issues of 12-layer HDI circuit boards for edge computing, this paper mainly discusses the noise interference, attenuation during signal transmission, and optimization methods for impedance matching. By establishing a circuit board model and conducting simulation analysis, a series of strategies to solve signal integrity problems are proposed, including selecting appropriate materials, optimizing layout design, and adjusting impedance control methods. Reasonable design and optimization can effectively improve the quality of signal transmission, providing an important reference for the development of high-performance edge computing devices.