Journal of Chemistry and Chemical Research
Journal of Chemistry and Chemical Research. 2025; 5: (2) ; 10.12208/j.jccr.20250041 .
总浏览量: 121
深圳市容微精密电子有限公司 广东深圳
*通讯作者： 何均,单位：深圳市容微精密电子有限公司 广东深圳；
聚焦低介电常数封装材料的等离子体处理工艺。阐述等离子体处理对低介电常数材料性能提升的关键作用，详细分析处理过程中如气体选择、功率调节、时间控制等工艺参数对材料介电性能、表面特性及机械性能的影响。通过深入研究与实践探索，提出一系列优化等离子体处理工艺的有效策略，旨在显著改善低介电常数封装材料性能，满足电子封装领域不断提升的性能需求，推动行业发展。
This paper focuses on optimizing plasma processing techniques for low-dielectric-constant packaging materials. It elucidates the critical role of plasma treatment in enhancing material performance, with detailed analysis of process parameters such as gas selection, power regulation, and time control that influence dielectric properties, surface characteristics, and mechanical properties. Through in-depth research and practical exploration, this study proposes effective strategies to optimize plasma processing techniques. These strategies aim to significantly improve the performance of low-dielectric-constant packaging materials, meet the growing performance demands in the electronic packaging industry, and drive technological advancement.
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