Active vibration suppression technology for micron-level precision platforms in chip packaging
面向芯片封装的微米级精密平台振动主动抑制技术

摘要

面向芯片封装的微米级精密平台在运行中易受多源振动干扰，影响定位精度与生产稳定性。本研究围绕振动主动抑制展开，构建高灵敏度检测模型与多通道实时反馈控制系统，实现对微米级位移扰动的快速感知与主动补偿。采用高带宽传感器与自适应控制算法，分层抑制不同频段振动，并结合有限元仿真与实验测试验证效果。结果显示，该技术可显著提升芯片封装操作的精度与稳定性，为高精度封装设备设计优化及微纳制造振动控制技术发展提供重要参考。

Abstract

Micron-level precision platforms for chip packaging are prone to interference from multi-source vibrations during operation, which affects positioning accuracy and production stability. This study focuses on active vibration suppression, constructing a high-sensitivity detection model and a multi-channel real-time feedback control system to achieve rapid sensing and active compensation of micron-level displacement disturbances. By using high-bandwidth sensors and adaptive control algorithms, vibrations in different frequency bands are suppressed in a hierarchical manner. The effectiveness is verified through finite element simulations and experimental tests. The results show that this technology can significantly improve the accuracy and stability of chip packaging operations, providing an important reference for the design optimization of high-precision packaging equipment and the development of vibration control technologies in micro-nano manufacturing.