Defect detection system for power transmission and transformation equipment using infrared and visible light image fusion
输变电设备红外图像与可见光融合的缺陷检测系统

摘要

先进封装技术在集成电路制造中扮演着越来越重要的角色，尤其在突破摩尔定律瓶颈方面展现出显著优势。围绕红外与可见光图像融合、缺陷识别中的融合算法以及多源图像协同检测等关键技术路径展开分析，揭示了当前技术的发展现状与核心挑战。研究显示，深度学习、多模态数据融合与高效算法设计是提升检测精度与系统智能化水平的关键。整体来看，相关技术正朝着高集成度、低延迟与强泛化能力方向演进，为多个高技术领域提供坚实支撑。

Abstract

Advanced packaging technology plays an increasingly important role in integrated circuit manufacturing, especially in breaking through the limitations of Moore's Law. By analyzing key technical paths such as infrared and visible light image fusion, fusion algorithms in defect recognition, and multi-source image collaborative detection, this study reveals the current development status and core challenges of these technologies. Research indicates that deep learning, multi-modal data fusion, and efficient algorithm design are crucial for improving detection accuracy and system intelligence. Overall, related technologies are evolving toward high integration, low latency, and strong generalization capabilities, providing solid support for multiple high-tech fields.